PCB Stack-Up Design: How to Coordinate Materials, Impedance and Manufacturability
Key Takeaways Stack-up design must coordinate material properties (Dk, Df, Tg), layer arrangement, and copper distribution Reference planes adjacent to signal layers are essential for controlled impedance and noise reduction Material selection depends on frequency, thermal requirements, and cost constraints Manufacturing constraints including panel utilization and layer registration affect stack-up options Early collaboration with your […]
PCB Surface Finish Comparison: ENIG, HASL, OSP, ENEPIG, Silver and Tin
PCB surface finish comparison is a critical decision point for any PCB design project. The surface finish applied to your PCB during fabrication directly affects solderability, shelf life, assembly reliability, and ultimately the performance of your end product. ENIG, lead-free HASL, OSP, ENEPIG, immersion silver, and tin-lead HASL each serve different applications, and selecting the […]