In High-Frequency PCB Design, Why Blind and Buried Vias Are Not Just “Good Enough If They Work”
When designing high-frequency PCBs, many people tend to focus on trace width, trace spacing, impedance, and materials, but often overlook one critical detail: the via structure. Especially for blind and buried vias, they may simply be used to save space on ordinary PCBs. But in high-frequency, high-speed, and HDI boards, they directly affect signal integrity, […]