IC Decapsulation & Data Recovery Service

Professional IC Decapsulation & Data Recovery | In-House Engineering Solution

When you face the following challenges:

• Damaged chips causing system failure

• Encrypted chips with inaccessible data

• Removed or erased chip markings

• Obsolete components with no replacement

👉 IC decapsulation and reverse engineering are often the most effective solutions.

1. What We Offer

We provide a full range of chip-level engineering services:

• IC decapsulation

• Data extraction and recovery

• Chip identification

• PCB reverse engineering

• Schematic and BOM generation

👉 From a single chip to a complete production-ready dataset, all handled in one place.

2. Fully In-House Execution

All critical processes are performed internally:

• Decapsulation

• Microscopic analysis

• Data processing

• Engineering output

👉 No outsourcing, ensuring process stability and consistent results.

3. Typical Applications

Our services are widely used for:

• Industrial equipment repair and recovery

• Product cloning and redesign

• Technical benchmarking and analysis

• Alternative component development

4. Project Workflow

1. Customer provides chip or PCB

2. Engineering evaluation (feasibility & risk)

3. Confirmation of solution and quotation

4. Decapsulation and analysis

5. Delivery of data and engineering files

5. Handling & Submission Guidelines

To improve success rates:

• Avoid physical damage to the chip

• Protect against electrostatic discharge (ESD)

• Do not touch exposed die surfaces

• Providing the full PCB is recommended

6. Our Working Approach

We focus on practical and reliable results:

• No exaggerated claims

• No unrealistic guarantees

• Engineering-driven execution

Chip-related issues are often the critical bottleneck of a project.
We provide not just decapsulation, but a stable and reproducible engineering solution.

👉 [Start Your Recovery Project]