Copper Core vs Aluminum Core PCB
Copper core vs aluminum core PCB represents a choice between premium thermal management solutions where the base metal’s thermal conductivity matters significantly. Copper provides 380-400 W/mK thermal conductivity versus aluminum at 167 W/mK, but both use similar thermal dielectrics (1-8 W/mK) that often limit overall performance more than the base metal choice. According to IPC-6013 […]
aluminum PCB vs FR4
Aluminum PCB vs FR4 represents a critical substrate selection decision that directly impacts thermal management capability, product reliability, and overall cost. While FR4 remains the standard choice for most digital logic applications, aluminum PCB (metal core PCB) provides 3-20x better thermal conductivity that becomes essential for LEDs above 1W and power electronics applications. According to […]