BGA Escape Routing HDI: A Complete Guide to Fan-Out Strategies
BGA escape routing in HDI PCBs is one of the most critical—and most challenging—aspects of modern high-density design. Fine-pitch BGAs with 0.4mm, 0.5mm, or 0.65mm pitch require specialized HDI techniques including via-in-pad, microvia fan-out, and layer jump strategies. Without these techniques, routing BGAs would be impossible or would require far more board layers than necessary. […]
Blind vs Buried Vias: Understanding HDI Via Technology
Blind vs buried vias are fundamental HDI PCB technologies that enable high-density interconnect designs by providing selective layer connectivity. Blind vias connect an outer layer to one or more inner layers without penetrating the entire board, while buried vias connect inner layers without appearing on outer surfaces. Understanding when to use each via type—and how […]