Via in Pad Filled and Capped: Technology, Applications, and Design Considerations
Via in Pad Filled and Capped: Complete HDI Guide (2026) Via in pad filled and capped is an HDI PCB technology where vias are placed directly in component mounting pads and filled with conductive or non-conductive materials, then optionally covered with cap plating to create a flat, planar surface for component mounting. This technique eliminates […]
Stacked vs Staggered Microvias: Which HDI Configuration Is Right for Your Design?
Stacked vs Staggered Microvias: HDI Configuration Guide (2026) Stacked and staggered microvias are two fundamental HDI PCB configurations that determine routing density, signal integrity, and manufacturing cost. Stacked microvias (1+N+1) align vias vertically for maximum density, while staggered configurations (2+N+2) offset vias horizontally for improved reliability. Understanding when to use each configuration depends on your […]